Project

# Title Team Members TA Documents Sponsor
13 Haptic Headset
 Danny Pellikan
Isabella Huang
Tasho Madondo
 Luoyan Li design_document1.pdf
design_document2.pdf
final_paper1.pdf
proposal1.pdf
proposal2.pdf
# Haptic Headset

Team Members:
- Tasho Madondo (madondo2)
- Isabella Huang (xhuang93)
- Danny Pellikan (djp8)

# Problem

Hearing is one of our most essential senses. Hearing is the only sensory system that allows us to know what is going on everywhere in our environment at once. This property of hearing offers great advantages for survival as most alerts can be heard before they are ever seen. Deaf individuals, and those hard of hearing, have lost those advantages; Due to this, they lack the awareness of their environment offered with sound. We aim to mitigate some of the struggles of those with hearing loss.

# Solution

As a solution, rather than relying on the sense of sound, they can use the sense of feeling to get information they need from their immediate surroundings with directional haptic feedback. Haptic feedback is the use of vibration to convey information to the user (for example play station controllers or phone notifications). The idea is to place individual vibration motors along the outer rings on each side of over-ear headphones or ear mufflers. When a loud enough sound is played from any direction to the user, each individual motor vibrates in a way to give the user a sense of directional feedback. The goal of this device is to give the user heads up on where to look to see where the sound came from regardless of how little they can hear from their surroundings.

# Solution Components

## Subsystem 1: Audio Sensing/Directionality/Sound Detection

The device will use microphones to pick up the sound from the surrounding environment. We currently have 1 idea for audio/directionality detection.
Method 1 Multiple Unidirectional Microphones: This method uses multiple small unidirectional microphones pointing in each direction on each ear to pick up the audio of the surrounding environment. Each sensor would then correspond to a direction so that, when triggered, the appropriate vibration motors will trigger corresponding to that sensor. The position of the sound sensors would be as follows: each earpiece (Left and Right) will have 9 sound sensors corresponding to the 8 directions around the ear (Front, Up, Down, Back, Front-Up, Front-Down, Back-Up, Back-Down) as well as the direction directly away from the ear (directly to the left or directly to the right)

Diagram of Outer Piece with Unidirectional Microphones - [https://mediaspace.illinois.edu/media/t/1_khyavyq1](url)

## Subsystem 2: Haptic Feedback

The information about a sound and where it is coming from is relayed through haptic feedback from the vibration motors along the ear. Vibration motors will be placed along the ring of each earpiece on both sides of the headphones. Each earpiece (left and right) will have 8 vibration motors around the ear (Front, Up, Down, Back, Front-Up, Front-Down, Back-Up, Back-Down). Based on the sensor's read, the corresponding vibration motors will trigger to give the impression of direction from the user. For example: Sound coming from directly to the left, will trigger the vibration motors on the left earpiece; Sound coming from above and behind, will trigger the Back-Up, Up, and Back vibration motors on both the left and right earpiece; Sound coming from above and in front but to the right, will trigger the right earpiece's Front-Up, Front, and Up vibration motors.

Diagram of Inner Piece with Vibration Motors - [https://mediaspace.illinois.edu/media/t/1_k664rq6s](url)

## Subsystem 3: Analog to Digital Microcontroller

This system will be used for taking the analog input from the unidirectional microphones and converting to a signal for the vibration motors. Consider the number of sensors being used we will most likely need an amplifier to for each microphone and analog to digital converter for the microcontroller.

# Criterion For Success

1. Audio Sensing: Sound sensors are able to pick up loud sound from the surrounding environment and determine the direction of the sound based on the trigger sensors.

2. Haptic Feedback: When given a direction, the appropriate vibration motors will trigger to inform the user of the direction.

3. Comfortable Fitting: The device fits well and comfortably on the user.

4. User Efficiency: User can effectively tell where external sound is coming from through the haptic feedback.

# More Diagrams of Device

Diagram of Device position of human head - [https://mediaspace.illinois.edu/media/t/1_byyz2p7u](url)

Diagram of Device attachment on over-ear headphones - [https://mediaspace.illinois.edu/media/t/1_bua29b7m](url)

Four Point Probe

Simon Danthinne, Ming-Yan Hsiao, Dorian Tricaud

Four Point Probe

Featured Project

# Four Point Probe

Team Members:

Simon Danthinne(simoned2)

Ming-Yan Hsiao(myhsiao2)

Dorian Tricaud (tricaud2)

# Problem:

In the manufacturing process of semiconductor wafers, numerous pieces of test equipment are essential to verify that each manufacturing step has been correctly executed. This requirement significantly raises the cost barrier for entering semiconductor manufacturing, making it challenging for students and hobbyists to gain practical experience. To address this issue, we propose developing an all-in-one four-point probe setup. This device will enable users to measure the surface resistivity of a wafer, a critical parameter that can provide insights into various properties of the wafer, such as its doping level. By offering a more accessible and cost-effective solution, we aim to lower the entry barriers and facilitate hands-on learning and experimentation in semiconductor manufacturing.

# Solution:

Our design will use an off-the-shelf four point probe head for the precision manufacturing tolerances which will be used for contact with the wafer. This wafer contact solution will then be connected to a current source precisely controlled by an IC as well as an ADC to measure the voltage. For user interface, we will have an array of buttons for user input as well as an LCD screen to provide measurement readout and parameter setup regarding wafer information. This will allow us to make better approximations for the wafer based on size and doping type.

# Solution Components:

## Subsystem 1: Measurement system

We will utilize a four-point probe head (HPS2523) with 2mm diameter gold tips to measure the sheet resistance of the silicon wafer. A DC voltage regulator (DIO6905CSH3) will be employed to force current through the two outer tips, while a 24-bit ADC (MCP3561RT-E/ST) will measure the voltage across the two inner tips, with expected measurements in the millivolt range and current operation lasting several milliseconds. Additionally, we plan to use an AC voltage regulator (TPS79633QDCQRQ1) to transiently sweep the outer tips to measure capacitances between them, which will help determine the dopants present. To accurately measure the low voltages, we will amplify the signal using an JFET op-amp (OPA140AIDGKR) to ensure it falls within the ADC’s specifications. Using these measurements, we can apply formulas with corrections for real-world factors to calculate the sheet resistance and other parameters of the wafer.

## Subsystem 2: User Input

To enable users to interact effectively with the measurement system, we will implement an array of buttons that offer various functions such as calibration, measurement setup, and measurement polling. This interface will let users configure the measurement system to ensure that the approximations are suitable for the specific properties of the wafer. The button interface will provide users with the ability to initiate calibration routines to ensure accuracy and reliability, and set up measurements by defining parameters like type, range, and size tailored to the wafer’s characteristics. Additionally, users can poll measurements to start, stop, and monitor ongoing measurements, allowing for real-time adjustments and data collection. The interface also allows users to make approximations regarding other wafer properties so the user can quickly find out more information on their wafer. This comprehensive button interface will make the measurement system user-friendly and adaptable, ensuring precise and efficient measurements tailored to the specific needs of each wafer.

## Subsystem 3: Display

To provide output to users, we will utilize a monochrome 2.4 inch 128x64 OLED LCD display driven over SPI from the MCU. This display will not only present data clearly but also serve as an interface for users to interact with the device. The monochrome LCD will be instrumental in displaying measurement results, system status, and other relevant information in a straightforward and easy-to-read format. Additionally, it will facilitate user interaction by providing visual feedback during calibration, measurement setup, and polling processes. This ensures that users can efficiently navigate and operate the device, making the overall experience intuitive and user-friendly.

# Criterion for Success:

A precise constant current can be run through the wafer for various samples

Measurement system can identify voltage (10mV range minimum) across wafer

Measurement data and calculations can be viewed on LCD

Button inputs allow us to navigate and setup measurement parameters

Total part cost per unit must be less than cheapest readily available four point probes (≤ 650 USD)

Project Videos