Project

# Title Team Members TA Documents Sponsor
52 Heated Bridge System + Seeking one partner
 Adriel Taparra
James Raue
Kahmil Hamzat
 Jiankun Yang design_document1.pdf
final_paper1.pdf
other1.pdf
photo1.jpg
photo2.jpeg
presentation1.pdf
proposal1.pdf
# Heated Bridge Safety System

**Team Members:**
- Kahmil Hamzat (khamza2)
- Adriel Taparra (taparra2)
- James Raue (jdraue2)

## Problem

During winter, bridges freeze faster than regular roads due to their exposure to cold air from all sides, making them hazardous for drivers. Existing solutions rely on passive warnings such as "Bridge Ices Before Road" signs, which do not actively prevent ice formation. Our goal is to create an active heating system that prevents ice and snow buildup on bridges, improving safety and reducing accidents caused by icy road conditions.


## Solution

Our project will implement a heated bridge system using an array of nichrome heating wires embedded in a simulated bridge surface. The simulated bridge will be a plywood model, with a metal sheet simulating the road surface and nichrome wires beneath the sheet for heat generation. The system will be controlled by a microcontroller that monitors real-time weather conditions via **temperature, moisture, and precipitation sensors**. If freezing conditions and moisture are detected, the system will activate the heating elements to prevent ice formation. A MOSFET-based power switching circuit will be used to regulate power delivery to the heating wires efficiently. When the microcontroller outputs HIGH, the MOSFET allows current to flow, heating the wire.


## Solution Components

### **Heating Subsystem**
- Nichrome wire heating elements embedded in a plywood bridge surface to simulate real-world conditions.
- MOSFET switching circuit to control power delivery based on microcontroller input.
- 12V/24V DC power source, either from a wall adapter or a rechargeable battery with a DC-DC converter.

### **Sensing and Control Subsystem**
- **Temperature sensor** to monitor surface temperatures.
- **Moisture sensor** to detect the presence of water on the surface.
- **Precipitation sensor** to determine if snow or rain is present.
- **Microcontroller** to process sensor data and activate the heating system accordingly.

### **Power and PCB Subsystem**
- **Custom PCB** designed to integrate the microcontroller, MOSFET power control circuit, and sensor connections.


## Criteria for Success

1. **Accurate sensing** – The system must reliably detect temperature, moisture, and precipitation to determine when heating is necessary.
2. **Effective heating** – The nichrome wire should generate enough heat to prevent ice formation on the bridge surface.
3. **Power efficiency** – The heating system should activate only when necessary to conserve power.
4. **Demonstrable functionality** – The prototype should successfully operate in a simulated environment (e.g., an ice box) and respond appropriately to changing conditions.

Four Point Probe

Simon Danthinne, Ming-Yan Hsiao, Dorian Tricaud

Four Point Probe

Featured Project

# Four Point Probe

Team Members:

Simon Danthinne(simoned2)

Ming-Yan Hsiao(myhsiao2)

Dorian Tricaud (tricaud2)

# Problem:

In the manufacturing process of semiconductor wafers, numerous pieces of test equipment are essential to verify that each manufacturing step has been correctly executed. This requirement significantly raises the cost barrier for entering semiconductor manufacturing, making it challenging for students and hobbyists to gain practical experience. To address this issue, we propose developing an all-in-one four-point probe setup. This device will enable users to measure the surface resistivity of a wafer, a critical parameter that can provide insights into various properties of the wafer, such as its doping level. By offering a more accessible and cost-effective solution, we aim to lower the entry barriers and facilitate hands-on learning and experimentation in semiconductor manufacturing.

# Solution:

Our design will use an off-the-shelf four point probe head for the precision manufacturing tolerances which will be used for contact with the wafer. This wafer contact solution will then be connected to a current source precisely controlled by an IC as well as an ADC to measure the voltage. For user interface, we will have an array of buttons for user input as well as an LCD screen to provide measurement readout and parameter setup regarding wafer information. This will allow us to make better approximations for the wafer based on size and doping type.

# Solution Components:

## Subsystem 1: Measurement system

We will utilize a four-point probe head (HPS2523) with 2mm diameter gold tips to measure the sheet resistance of the silicon wafer. A DC voltage regulator (DIO6905CSH3) will be employed to force current through the two outer tips, while a 24-bit ADC (MCP3561RT-E/ST) will measure the voltage across the two inner tips, with expected measurements in the millivolt range and current operation lasting several milliseconds. Additionally, we plan to use an AC voltage regulator (TPS79633QDCQRQ1) to transiently sweep the outer tips to measure capacitances between them, which will help determine the dopants present. To accurately measure the low voltages, we will amplify the signal using an JFET op-amp (OPA140AIDGKR) to ensure it falls within the ADC’s specifications. Using these measurements, we can apply formulas with corrections for real-world factors to calculate the sheet resistance and other parameters of the wafer.

## Subsystem 2: User Input

To enable users to interact effectively with the measurement system, we will implement an array of buttons that offer various functions such as calibration, measurement setup, and measurement polling. This interface will let users configure the measurement system to ensure that the approximations are suitable for the specific properties of the wafer. The button interface will provide users with the ability to initiate calibration routines to ensure accuracy and reliability, and set up measurements by defining parameters like type, range, and size tailored to the wafer’s characteristics. Additionally, users can poll measurements to start, stop, and monitor ongoing measurements, allowing for real-time adjustments and data collection. The interface also allows users to make approximations regarding other wafer properties so the user can quickly find out more information on their wafer. This comprehensive button interface will make the measurement system user-friendly and adaptable, ensuring precise and efficient measurements tailored to the specific needs of each wafer.

## Subsystem 3: Display

To provide output to users, we will utilize a monochrome 2.4 inch 128x64 OLED LCD display driven over SPI from the MCU. This display will not only present data clearly but also serve as an interface for users to interact with the device. The monochrome LCD will be instrumental in displaying measurement results, system status, and other relevant information in a straightforward and easy-to-read format. Additionally, it will facilitate user interaction by providing visual feedback during calibration, measurement setup, and polling processes. This ensures that users can efficiently navigate and operate the device, making the overall experience intuitive and user-friendly.

# Criterion for Success:

A precise constant current can be run through the wafer for various samples

Measurement system can identify voltage (10mV range minimum) across wafer

Measurement data and calculations can be viewed on LCD

Button inputs allow us to navigate and setup measurement parameters

Total part cost per unit must be less than cheapest readily available four point probes (≤ 650 USD)

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