Project

# Title Team Members TA Documents Sponsor
14 Enhanced Golf Rangefinder
 Peter Maestranzi
Emma DiBiase
Jacob Hindenburg
**Team Members:**

Peter Maestranzi (petervm2)

Jake Hindenburg (jacobh6)

Emma DiBiase (emmamd2)

**Problem:**

Golf is an extremely difficult game that requires a great deal of precision. There are a multitude of factors that can affect a single golf shot such as distance, weather conditions, and club choice. Modern rangefinders gauge distance well, with some even able to show yardage adjustments for changes in elevation. However, rangefinders still lack many features that could help average or new golfers improve quickly.

**Solution:**

The solution to the problem would be to create an enhanced rangefinder that adds several new features. The distance would be measured through a time-of-flight sensor, a commonly used component in rangefinders. To make our project unique, we would integrate several other components to help measure a more precise distance. This would consist of more sensors measuring factors such as wind speed, humidity, and temperature. The adjusted distance due to these factors would be updated on the rangefinder and shown through an LCD display. Another component that would be utilized in our device would be a Bluetooth user interface. Based on the readings from the rangefinder, a Bluetooth component on the user’s phone can supply all the necessary information for that specific shot and provide a club recommendation. Using a microprocessor with Bluetooth capabilities, this subsystem would be achievable and crucial to making our device unique. All our devices’ components would be secured within a 3D-printed enclosure that is both safe and easy to handle.

**Subsystem 1: Microprocessor**

For our microprocessor, we will use an ESP32-S3-WROOM-1-N16 as it supports Wi-Fi and Bluetooth capabilities. We will have added room for any additional UI features, GPIOS, and programming capabilities with plenty of extra power.

**Subsystem 2: Distance Tracking System**

The main component of the Distance Tracking System is a time-of-flight (ToF) sensor such as the JRT D09C Laser Distance Sensor. ToF would help measure the distance to any object that the golfer points at. These are very common in normal rangefinders, so the crucial part of this system for our project would be the interfacing that occurs with other systems that would provide an adjusted distance based on measurements of the environment.

**Subsystem 3: Environment System**

For the environmental system, we will detect ambient conditions that will directly affect the golf shot. This includes a hot-wire wind sensor with analog output for wind speed (Modern Device Wind Sensor Rev. C), as well as the Bosch BME280 to detect humidity and temperature as these directly correlate to increasing/decreasing yards. This subsystem is essential because it provides the additional assistance/feedback that golfers need to improve, giving us the “enhanced” rangefinder.

**Subsystem 4: Power System**

A Lipo battery such as the EEMB 3.7V Lipo Battery 500mAh should be sufficient to power each component.

**Subsystem 5: User Interface + Bluetooth Application**

A physical LCD display will be used to display distance measurements and wind speed which will be triggered by a push button on the mechanical enclosure. Using Bluetooth capabilities, an application on a phone or pc will be able to give users more information on club selection based on the conditions read.

**Subsystem 6: Mechanical Enclosure**

The enclosure is an important component to our project because it needs to safely contain all our systems while also being user-friendly. The enclosure would be 3D-printed and would properly mount all sensors and displays accordingly.

**Criterion for Success**

This project will be successful if we meet the following criteria:
- The rangefinder measures the correct distance from the user to the flag pin.
- Environmental sensors provide proper feedback to the user regarding wind, humidity, and temperature conditions
- The UI recommends a suitable club based on the distance to the pin and the environmental conditions

Four Point Probe

Simon Danthinne, Ming-Yan Hsiao, Dorian Tricaud

Four Point Probe

Featured Project

# Four Point Probe

Team Members:

Simon Danthinne(simoned2)

Ming-Yan Hsiao(myhsiao2)

Dorian Tricaud (tricaud2)

# Problem:

In the manufacturing process of semiconductor wafers, numerous pieces of test equipment are essential to verify that each manufacturing step has been correctly executed. This requirement significantly raises the cost barrier for entering semiconductor manufacturing, making it challenging for students and hobbyists to gain practical experience. To address this issue, we propose developing an all-in-one four-point probe setup. This device will enable users to measure the surface resistivity of a wafer, a critical parameter that can provide insights into various properties of the wafer, such as its doping level. By offering a more accessible and cost-effective solution, we aim to lower the entry barriers and facilitate hands-on learning and experimentation in semiconductor manufacturing.

# Solution:

Our design will use an off-the-shelf four point probe head for the precision manufacturing tolerances which will be used for contact with the wafer. This wafer contact solution will then be connected to a current source precisely controlled by an IC as well as an ADC to measure the voltage. For user interface, we will have an array of buttons for user input as well as an LCD screen to provide measurement readout and parameter setup regarding wafer information. This will allow us to make better approximations for the wafer based on size and doping type.

# Solution Components:

## Subsystem 1: Measurement system

We will utilize a four-point probe head (HPS2523) with 2mm diameter gold tips to measure the sheet resistance of the silicon wafer. A DC voltage regulator (DIO6905CSH3) will be employed to force current through the two outer tips, while a 24-bit ADC (MCP3561RT-E/ST) will measure the voltage across the two inner tips, with expected measurements in the millivolt range and current operation lasting several milliseconds. Additionally, we plan to use an AC voltage regulator (TPS79633QDCQRQ1) to transiently sweep the outer tips to measure capacitances between them, which will help determine the dopants present. To accurately measure the low voltages, we will amplify the signal using an JFET op-amp (OPA140AIDGKR) to ensure it falls within the ADC’s specifications. Using these measurements, we can apply formulas with corrections for real-world factors to calculate the sheet resistance and other parameters of the wafer.

## Subsystem 2: User Input

To enable users to interact effectively with the measurement system, we will implement an array of buttons that offer various functions such as calibration, measurement setup, and measurement polling. This interface will let users configure the measurement system to ensure that the approximations are suitable for the specific properties of the wafer. The button interface will provide users with the ability to initiate calibration routines to ensure accuracy and reliability, and set up measurements by defining parameters like type, range, and size tailored to the wafer’s characteristics. Additionally, users can poll measurements to start, stop, and monitor ongoing measurements, allowing for real-time adjustments and data collection. The interface also allows users to make approximations regarding other wafer properties so the user can quickly find out more information on their wafer. This comprehensive button interface will make the measurement system user-friendly and adaptable, ensuring precise and efficient measurements tailored to the specific needs of each wafer.

## Subsystem 3: Display

To provide output to users, we will utilize a monochrome 2.4 inch 128x64 OLED LCD display driven over SPI from the MCU. This display will not only present data clearly but also serve as an interface for users to interact with the device. The monochrome LCD will be instrumental in displaying measurement results, system status, and other relevant information in a straightforward and easy-to-read format. Additionally, it will facilitate user interaction by providing visual feedback during calibration, measurement setup, and polling processes. This ensures that users can efficiently navigate and operate the device, making the overall experience intuitive and user-friendly.

# Criterion for Success:

A precise constant current can be run through the wafer for various samples

Measurement system can identify voltage (10mV range minimum) across wafer

Measurement data and calculations can be viewed on LCD

Button inputs allow us to navigate and setup measurement parameters

Total part cost per unit must be less than cheapest readily available four point probes (≤ 650 USD)

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