Project

# Title Team Members TA Documents Sponsor
6 SMART GLASSES FOR HANDS-FREE DATASHEET RETRIEVAL
Hridik Hingorani
Preity Varanasi
Shiv Bahl
Team Members:

Hridik Hingorani

Shiv Bahl

Preity Varanasi

Problem

When working with electronic hardware, engineers frequently need to stop what they are doing to identify a component, search for its datasheet, and locate specific information such as pinouts, voltage limits, timing specifications, or recommended operating conditions.
This interrupts the workflow and is particularly inconvenient when the user is soldering, probing a circuit, or otherwise using both hands.
Our goal is to reduce this interruption by creating a low-cost wearable system that can identify an electronic component being viewed by the user and automatically retrieve the corresponding datasheet.
Solution
We propose building a pair of smart glasses containing a camera and a custom embedded PCB.
When the user looks at a component and activates the system, the camera will capture an image and send it wirelessly to a laptop. The laptop will use computer vision and OCR to extract identifying information such as the component's part number or package markings.
Once the component has been identified, the laptop will locate the appropriate datasheet and process it so that important information can be retrieved quickly. The result will initially be displayed on the laptop.
The system is intended primarily for clearly labeled electronic components such as integrated circuits, modules, sensors, and other devices whose identifying markings can be captured by the camera.

High-Level System

Smart Glasses
Camera → Embedded PCB → Wi-Fi Communication

Laptop
Image Processing/OCR → Component Identification → Datasheet Retrieval → Datasheet Processing → User Output

Hardware

We will design a custom PCB mounted on or integrated into the glasses.

The PCB will include:
ESP32-based microcontroller
Camera interface
Wireless communication
User input for triggering image capture
Power regulation
Battery/power management
Necessary supporting circuitry
The embedded system will be responsible for capturing images, managing the camera, handling user input, and wirelessly transmitting data to the laptop.
The glasses themselves will be inexpensive commercially available frames modified to hold our electronics.

Software

The laptop-side software will:
Receive the image from the glasses.
Process the image to improve readability of component markings.
Use OCR/computer vision to determine the component identifier.
Search for and retrieve the correct datasheet.
Parse the datasheet and make relevant specifications accessible to the user.
Display the component identity, datasheet, and requested information on the laptop.
The LLM will only answer questions using information retrieved from the identified component's datasheet rather than relying solely on its existing knowledge.

Requirements

For a successful final demonstration, the system should:
Capture a usable image from the wearable camera.
Wirelessly transfer the image from the glasses to the laptop.
Correctly identify a predefined set of clearly marked electronic components.
Retrieve the correct datasheet associated with the identified component.
Extract and display relevant information from that datasheet.
Operate using our custom PCB rather than a standalone commercial development board.
Be wearable and operate without a wired connection between the glasses and laptop.
We will create a test set of electronic components and quantitatively evaluate component-identification accuracy and end-to-end response time.

Stretch Goal

Our stretch goal is to make the system fully hands-free after component identification by adding voice interaction.
The user would be able to ask questions such as:
"What is the maximum supply voltage?"
"What does pin 4 do?"
"What value capacitor does the manufacturer recommend here?"
The system would transcribe the question, search the retrieved datasheet, and provide an answer grounded specifically in that datasheet.

Future Work

A future version could integrate a small near-eye or AR display into the glasses so that information could be presented directly in the user's field of view.
An AR display is not part of the scope of this semester's project.
Complexity
The project combines several independently testable hardware and software subsystems:
Custom wearable PCB design
Camera interfacing
Battery and power-management circuitry
Wireless embedded communication
Image processing
OCR/component identification
Automated datasheet retrieval
Datasheet parsing and information extraction
Integration between the embedded hardware and laptop software
A major technical challenge will be reliably extracting part markings from small electronic components under different viewing angles, distances, orientations, and lighting conditions.

Uniqueness

Existing smart glasses and visual assistants are generally designed for broad image recognition or general-purpose AI assistance.
Our project is specifically designed around electronics work. Instead of simply describing what the camera sees, the system will identify a specific electronic component, locate its technical documentation, and provide information grounded in the manufacturer's datasheet.
The project therefore combines a purpose-built wearable embedded platform with a specialized datasheet retrieval and processing pipeline.

Scope

The core project will focus on labeled electronic components and laptop-based output. We will not attempt to recognize every possible component or construct an AR display during this semester.
Restricting the identification problem to a controlled but varied set of components allows us to quantitatively evaluate the system while still addressing the major technical challenges of wearable image acquisition, wireless communication, component identification, datasheet retrieval, and system integration.

Four Point Probe

Simon Danthinne, Ming-Yan Hsiao, Dorian Tricaud

Four Point Probe

Featured Project

# Four Point Probe

Team Members:

Simon Danthinne(simoned2)

Ming-Yan Hsiao(myhsiao2)

Dorian Tricaud (tricaud2)

# Problem:

In the manufacturing process of semiconductor wafers, numerous pieces of test equipment are essential to verify that each manufacturing step has been correctly executed. This requirement significantly raises the cost barrier for entering semiconductor manufacturing, making it challenging for students and hobbyists to gain practical experience. To address this issue, we propose developing an all-in-one four-point probe setup. This device will enable users to measure the surface resistivity of a wafer, a critical parameter that can provide insights into various properties of the wafer, such as its doping level. By offering a more accessible and cost-effective solution, we aim to lower the entry barriers and facilitate hands-on learning and experimentation in semiconductor manufacturing.

# Solution:

Our design will use an off-the-shelf four point probe head for the precision manufacturing tolerances which will be used for contact with the wafer. This wafer contact solution will then be connected to a current source precisely controlled by an IC as well as an ADC to measure the voltage. For user interface, we will have an array of buttons for user input as well as an LCD screen to provide measurement readout and parameter setup regarding wafer information. This will allow us to make better approximations for the wafer based on size and doping type.

# Solution Components:

## Subsystem 1: Measurement system

We will utilize a four-point probe head (HPS2523) with 2mm diameter gold tips to measure the sheet resistance of the silicon wafer. A DC voltage regulator (DIO6905CSH3) will be employed to force current through the two outer tips, while a 24-bit ADC (MCP3561RT-E/ST) will measure the voltage across the two inner tips, with expected measurements in the millivolt range and current operation lasting several milliseconds. Additionally, we plan to use an AC voltage regulator (TPS79633QDCQRQ1) to transiently sweep the outer tips to measure capacitances between them, which will help determine the dopants present. To accurately measure the low voltages, we will amplify the signal using an JFET op-amp (OPA140AIDGKR) to ensure it falls within the ADC’s specifications. Using these measurements, we can apply formulas with corrections for real-world factors to calculate the sheet resistance and other parameters of the wafer.

## Subsystem 2: User Input

To enable users to interact effectively with the measurement system, we will implement an array of buttons that offer various functions such as calibration, measurement setup, and measurement polling. This interface will let users configure the measurement system to ensure that the approximations are suitable for the specific properties of the wafer. The button interface will provide users with the ability to initiate calibration routines to ensure accuracy and reliability, and set up measurements by defining parameters like type, range, and size tailored to the wafer’s characteristics. Additionally, users can poll measurements to start, stop, and monitor ongoing measurements, allowing for real-time adjustments and data collection. The interface also allows users to make approximations regarding other wafer properties so the user can quickly find out more information on their wafer. This comprehensive button interface will make the measurement system user-friendly and adaptable, ensuring precise and efficient measurements tailored to the specific needs of each wafer.

## Subsystem 3: Display

To provide output to users, we will utilize a monochrome 2.4 inch 128x64 OLED LCD display driven over SPI from the MCU. This display will not only present data clearly but also serve as an interface for users to interact with the device. The monochrome LCD will be instrumental in displaying measurement results, system status, and other relevant information in a straightforward and easy-to-read format. Additionally, it will facilitate user interaction by providing visual feedback during calibration, measurement setup, and polling processes. This ensures that users can efficiently navigate and operate the device, making the overall experience intuitive and user-friendly.

# Criterion for Success:

A precise constant current can be run through the wafer for various samples

Measurement system can identify voltage (10mV range minimum) across wafer

Measurement data and calculations can be viewed on LCD

Button inputs allow us to navigate and setup measurement parameters

Total part cost per unit must be less than cheapest readily available four point probes (≤ 650 USD)

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